Principal Engineer – Process Integration Team Lead
Department: R&D / Power Module Business Group
Reporting to: R&D Vice Director and Power Module Business Group Manager
As Dynex continues to evolve and strengthen its technical capabilities, we have an exciting opportunity for an experienced and forward-thinking Principal Engineer – Process Integration Team Lead to play a key role in the development and industrialisation of our power semiconductor modules.
This is a pivotal leadership position, responsible for bridging the gap between research and development (R&D) and manufacturing, ensuring the successful transition of innovative power module technologies from design through to full-scale production.
Leading a newly established Process Integration Team, you will drive process excellence, new product introduction (NPI), quality improvements and manufacturing readiness. You will also play a central role in developing and implementing our Advanced Product Quality Planning (APQP) framework, ensuring alignment with customer expectations, industry standards and the requirements of our parent company, Times Semiconductor Co. Ltd.
Working collaboratively across R&D, Manufacturing, Quality and Product Engineering, you will have the opportunity to influence technical strategy, develop engineering capabilities and deliver meaningful improvements in product quality, reliability, efficiency and cost.
Key Responsibilities
Leadership & Team Development
- Lead, mentor and develop the Process Integration Team, initially comprising approximately three engineers, with potential for future expansion.
- Provide technical direction and leadership, fostering a collaborative, innovative and high-performing engineering environment.
- Manage team priorities, resources and project deliverables to ensure alignment with business objectives.
- Support technical knowledge sharing, professional development, succession planning and continuous improvement.
- Promote a strong culture of quality, accountability, operational excellence and health and safety.
Process Integration & Manufacturing Excellence
- Lead process integration activities for power module manufacturing, ensuring robust, repeatable and efficient processes that deliver high product quality, reliability and yield.
- Standardise and optimise established manufacturing technologies, including wire bonding, soldering, gel potting and other semiconductor packaging processes.
- Facilitate the transfer and integration of proven manufacturing technologies from Times Semiconductor Co. Ltd., alongside advanced technologies developed internally by Dynex R&D.
- Develop and implement process solutions for new power module products, supporting the evolution and optimisation of packaging process platforms.
- Drive improvements in manufacturing processes, materials, equipment capability and process control to meet product performance, quality, delivery and cost objectives.
- Lead initiatives to improve manufacturing yield, reduce process variation and achieve or exceed established production performance targets.
- Develop and maintain technical process documentation, packaging material specifications, manufacturing procedures and engineering reports.
New Product Introduction (NPI)
- Take ownership of the successful introduction of new power module products across Dynex manufacturing facilities, including the existing lead-free production line, upgraded pilot line and new production lines.
- Lead the transition of products from design freeze through qualification and into full-scale manufacturing, ensuring technical and operational readiness.
- Establish, standardise and continuously improve NPI procedures, ensuring consistent application of APQP methodologies and quality gate requirements.
- Develop annual NPI objectives, establish project milestones and monitor progress against agreed performance indicators.
- Coordinate cross-functional teams and resources to ensure new products are introduced safely, efficiently and within agreed timescales.
- Act as the quality gate controller for QG3, owner for QG4 and enabler for QG5, ensuring products meet the necessary technical, quality and manufacturing requirements at each stage.
- Monitor and deliver annual targets for power module products progressing through QG4 and QG5 qualification stages.
Quality Assurance & Continuous Improvement
- Lead the development, implementation and ongoing improvement of Dynex's APQP framework, ensuring alignment with Times Semiconductor Co. Ltd. and key customer requirements.
- Champion the effective use of quality planning and problem-solving methodologies, including Statistical Process Control (SPC), Measurement System Analysis (MSA) and 8D.
- Work collaboratively with R&D, Product Group, Quality and Manufacturing teams to embed consistent quality standards throughout the product lifecycle.
- Lead technical investigations into complex manufacturing and product quality issues, identifying root causes and implementing sustainable corrective and preventative actions.
- Support the resolution of process and platform-related issues arising during the early stages of mass production.
- Drive initiatives to improve product reliability, reduce defects and achieve continuous reductions in parts per million (PPM) defect rates.
- Act as a key technical interface for customer complaints, product failure analysis and process-related quality concerns.
- Ensure the timely preparation, review and release of APQP documentation and relevant quality records.
Product & Process Management
- Oversee the development and maintenance of Bills of Materials (BOMs) for new products, ensuring accuracy, cost control and effective change management.
- Establish and maintain BOM management procedures, including updates within the Epicor ERP system and the definition of material quality acceptance criteria.
- Support the development and optimisation of packaging materials, manufacturing process flows and production specifications.
- Collaborate with engineering and manufacturing teams to ensure new technologies and processes are technically viable, cost-effective and suitable for volume production.
- Provide expert technical guidance on process capability, equipment requirements, production constraints and manufacturing improvements.
About You
We are looking for an accomplished engineer who combines strong technical expertise with the ability to lead people, influence decisions and deliver complex engineering projects.
You will have a solid understanding of power semiconductor module packaging and manufacturing processes, together with a passion for innovation, quality and continuous improvement.
Whether you are an established technical leader or an experienced engineer ready to take the next step into a leadership role, you will bring the confidence, initiative and collaborative approach needed to make a positive impact.
Essential Skills & Experience
- A degree in Electronics, Electrical Engineering, Mechanical Engineering, Materials Engineering, Physics or a closely related discipline.
- Significant industrial experience in power semiconductor module packaging, process development, manufacturing engineering, production quality or a related technical environment.
- Strong technical knowledge of power module manufacturing processes, packaging materials, equipment capabilities, process control and product reliability.
- Practical experience of process integration, manufacturing technology transfer or new product introduction.
- Knowledge of APQP principles, quality planning methodologies and associated documentation requirements.
- Experience of applying structured problem-solving and root cause analysis techniques to complex technical or manufacturing challenges.
- Demonstrable leadership capability, gained through technical project leadership, cross-functional coordination, mentoring or direct team management.
- The ability to lead multidisciplinary project teams, influence stakeholders and coordinate activities across different engineering functions.
- Strong project management and organisational skills, with the ability to manage competing priorities, identify risks and deliver against demanding timescales.
- Excellent communication and interpersonal skills, with the ability to explain complex technical information and build effective working relationships.
- A proactive, solutions-focused approach, with sound technical judgement and a commitment to achieving high standards.
Desirable Skills & Experience
- Experience of leading engineering teams or managing complex, cross-functional technical projects involving multiple stakeholders.
- Detailed knowledge of APQP tools and methodologies, including SPC, MSA and 8D.
- Experience of high-voltage power semiconductor module design, packaging technologies, materials and applications.
- Understanding of power module manufacturing equipment, process parameters, maintenance requirements, production layouts and cleanroom environments.
- Knowledge of production line operations, including process flows, production capacity, shift arrangements and engineering change control.
- Experience of developing or optimising manufacturing processes to improve yield, reliability, efficiency and cost.
- Familiarity with ERP systems, particularly Epicor, and BOM management.
- Experience of working within a quality gate or stage-gate product development framework.
- Chartered Engineer status or membership of a relevant professional institution, such as the IET, IOP or IEEE.
What Will Make You Successful?
You will:
- be someone who enjoys combining hands-on technical problem-solving with strategic engineering leadership.
- thrive in a multidisciplinary environment, working closely with colleagues across R&D, Product Engineering, Quality and Manufacturing to turn innovative concepts into reliable, manufacturable products.
- be confident challenging existing processes, introducing improvements and making informed engineering decisions that positively influence product performance and business outcomes.
Above all, you will bring the enthusiasm, adaptability and leadership mindset needed to establish a successful team and support Dynex's continued growth.
Additional Requirements
The role requires flexibility to undertake occasional international business travel, including visits to China, to support technical collaboration, knowledge transfer and business development activities.